Buzz
AMD's desktop Ryzen 7000 series processors feature a basic RDNA2 iGPU with 2 EUs equivalent to 128 graphics processing cores. The cores operate at a base clock of 400MHz and a maximum clock of 2200MHz, providing computational performance at 0.563 TFLOPS, slightly faster than the Nintendo Switch graphics processor.
In a previous article, we discussed the potential overclocking capabilities of the integrated RDNA2 graphics cores on Ryzen 7000 series CPUs, achieving up to a 42% performance improvement. PCMag has now tested the iGPU on Ryzen 7000X3D series CPUs, specifically the Ryzen 9 7950X3D, and achieved surprising results.
Thanks to the innovative 3D V-Cache memory design, Ryzen 7000X3D series processors demonstrate a performance improvement of up to 4.3 times at 720p resolution and 4 times at 1080p resolution compared to Ryzen 7000 series processors.
PCMag's test included games such as F1 2022, Total War: Three Kingdoms, Tomb Raider, and Bioshock Infinite. While the performance in these games still lags behind Intel's integrated graphics on desktop processors, the impressive performance improvement highlights the significant impact of 3D V-Cache memory on APUs.
Despite that, some of AMD's APUs come equipped with powerful integrated graphics cores such as the RDNA3 iGPU with 12 processing units on the Ryzen 7040 'Phoenix' series intended for mobile devices, expected to be updated in AMD's next desktop processor generations.
However, RDNA3 iGPU processors have shown signs of memory bandwidth bottleneck. Therefore, the 3D V-cache memory with stacked 3D memory chips, as seen in the Ryzen 7000X3D processors, can deliver impressive performance improvements.
Apart from that, the current scenario has shown that 3D V-cache memory is only equipped in processors using chiplet designs, while APUs still adhere to monolithic designs. The gaming performance enhancement brought by 3D V-Cache could potentially redefine the standards for gaming enthusiasts.
Ngoài ra, các dòng
CPU AMDMoreover, the Dragon Range series, specifically the Ryzen 7045 series, incorporates chip dies designed for desktop processors but lacks the implementation of 3D V-Cache, catering to mobile devices.
Finally, with the information indicating that Intel will equip integrated graphics with a new architecture named tGPU (Tiled-GPU) on the upcoming Meteor Lake and Arrow Lake generations. AMD's potential adoption of 3D V-Cache technology would be a remarkable step forward, enabling the company to compete on an equal footing with its competitors. The crucial question remains: how long will we have to wait for AMD to implement 3D V-Cache technology in the next generations of APUs.
