Earlier this year, Loongson, a prominent Chinese tech company, unveiled its first self-developed 16-core processor, the 3C5000. Today, the company continues to push the boundaries by introducing the 32-core variant, the 3D5000. Loongson's approach closely resembles AMD's chiplet design, where two 16-core processors are seamlessly integrated.
As for the 3C5000, this processor boasts 16 LA64 cores utilizing the LoongArch architecture, a 64 MB cache, and support for 4 channels of DDR4-3200 memory with ECC. The 32-core version comprises 2 3C5000 processors fused on the same substrate, expanding memory channel support to 8 channels. The 3D5000 also supports simultaneous 4-way processing, enabling a server to be equipped with 4 CPUs for a total of 128 cores. Loongson has recently completed the certification process for the 3D5000, revealing that this CPU consumes 130 W at a clock speed of 2 GHz and 170 W at 2.2 GHz.Loongson reports that the 3D5000 achieves a score of 400 points in Spec CPU2006. When configured for dual-way parallel processing, it reaches 800 points, and similarly, with 4-way processing, it achieves 1600 points. The company is preparing to deliver sample chips to machine-making partners, expected in the first half of 2023, with commercial versions to follow.The debut of the 3D5000 marks a notable achievement for Loongson, serving as a testbed for their chiplet design. However, Loongson's products may face challenges in competing with industry giants like AMD or Intel, especially in the context of SMIC - the chip manufacturer for Loongson, which still struggles to access advanced process nodes like TMSC due to US sanctions.Tom's Hardware