Investigating the vapor chamber of RX 7900 XTX, the cause of excessive heat remains elusive.

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Der8auer's latest video reveals the professional overclocker's dissection of the vapor chamber on the RX 7900 XTX, aiming to uncover the source of overheating issues. After numerous tests, Der8auer concludes that the design of the vapor chamber is responsible for hot spots reaching up to 110 degrees Celsius on some RX 7900 XTX models.Using CNC drilling, Der8auer cuts into the vapor chamber from the underside at various points, yet no abnormalities in design are found. The vapor chamber consists of top and bottom covers, a wick structure, and copper posts. The principle remains: liquid inside absorbs heat from the GPU, vaporizes, is cooled by fans, condenses, and circulates. Despite this, MBA card models still face excessive hot spots, though no structural issues within the vapor chamber are apparent.

Previously, Igor Wallossek - an AMD partner specializing in vapor chamber cooling design - raised suspicions that some RX 7900 XTX cards were experiencing hotspot issues due to insufficient liquid inside. Der8auer also mentioned that even a slight shortage of liquid, only a few ml, could impact cooling performance. Currently, there is no official information from AMD, and we can only speculate about the cause.

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