Leaked details of Dimensity 8300 chip: 4nm process, up to 3.35GHz clock speed

Today, well-known leaker Digital Chat Station has shared with us detailed technical specifications of this chip.

According to the latest leaks, the Dimensity 8300 SoC will be built on TSMC's 4nm process. Its CPU configuration consists of 8 cores, including a single high-performance Cortex-A715 core clocked at 3.35GHz, three additional Cortex-A715 performance cores running at 3.32GHz, and four power-efficient Cortex-A510 cores operating at 2.2GHz. Graphics are handled by the Mali-G615 MC6 GPU.

This 4+4 core configuration is similar to the architecture of the Dimensity 8200 chipset. Here, the four Cortex-A715 cores will handle most performance-intensive tasks, while the four Cortex-A510 cores will focus on energy efficiency.

The Dimensity 8300 chip was recently discovered on the Geekbench 6 list of the upcoming Redmi K70 smartphone. It achieved a single-core score of 1,512 and a multi-core score of 4,886. This performance is slightly higher than that of the Dimensity 8200 and 8200-Ultra chipsets.

According to leaker Digital Chat Station, the performance of Dimensity 8300 is expected to surpass that of the Qualcomm Snapdragon 7+ Gen 2 SoC. Let's wait and see!