Today, renowned leaker Digital Chat Station has unveiled the launch timing for the successor to Dimensity 9200.

The latest leaks suggest that MediaTek will unveil the Dimensity 9300 chip in November. X100 and X100 Pro are ready to become the first line to use this SoC. Both are also expected to debut next month. Meanwhile, the X100 Pro+ model will be equipped with the Snapdragon 8 Gen 3 SoC, possibly launching in Q1 2024.
The MediaTek Dimensity 9300 chipset is expected to be manufactured using TSMC's advanced 4nm process and will feature a configuration consisting of 1 main ARM Cortex-X4 core, 3 Cortex-X4 cores, and 4 Cortex-A720 cores, delivering improved energy efficiency compared to its predecessor. Notably, the super-large Cortex-X4 core, based on the Armv9 architecture, will surpass the performance boundaries of smartphones, providing a 15% increase over the X3, while reducing energy consumption by 40%.
Overall, leaked specifications of the Dimensity 9300 chipset reveal impressive performance improvements as well as energy efficiency enhancements. This enables it to compete on par with Snapdragon 8 Gen 3 as well as A17 Pro.
For more details: Mediatek Dimensity 9300 will feature 8 high-performance cores, without any power-saving cores.