Buzz
MediaTek recently collaborated with Xiaomi to unveil the Dimensity 8200-Ultra processor. This partnership aims to deliver a high-performance chip with exceptional photography capabilities.
Xiaomi's official Weibo account has confirmed that the first smartphone featuring this processor will be the Xiaomi Civi 3.
Xiaomi Civi 3 to Be the First Phone Utilizing Dimensity 8200 Ultra ChipDimensity 8200-Ultra is manufactured using TSMC's advanced 4nm process, featuring 4 high-performance Cortex A78 cores and 4 energy-efficient Cortex A55 cores. The SoC has undergone performance testing on AnTuTu Benchmark, achieving a score of up to 900,000 points.
Dimensity 8200 Ultra UnveiledMediaTek and Xiaomi's collaboration harnesses the strengths of both companies to optimize Dimensity 8200-Ultra's photography support capabilities. Xiaomi, renowned for its expertise in algorithms and imaging technology, showcases achievements across various technical aspects of photography. On the other hand, MediaTek brings deep experience in the field of mobile imaging.
Dimensity 8200 Ultra Focuses on PhotographyThe new Dimensity SoC seamlessly integrates MediaTek's platform with Xiaomi's imaging capabilities. Xiaomi's Imaging Brain, supported by advanced algorithms, has gained recognition and success in the industry, particularly in portrait photography, fast capturing, and low-light scenes. To ensure compatibility and efficiency, Xiaomi has created a versatile cross-platform layer, facilitating easy adaptation of Imaging Brain to the Dimensity mobile platform, streamlining the adaptive process for future updates.
Chen Junhong, Deputy General Manager of MediaTek's Wireless Communications Business Unit, expressed excitement about the upcoming Xiaomi Civi 3 phone, stating that it will surprise consumers with its glossy design, impressive performance, and exceptional photography capabilities.
