Buzz
Recently, the notable leaker Digital Chat Station revealed intriguing details about the design and display of the upcoming Xiaomi 13. He mentioned that the standard Xiaomi 13 will have a flat screen with 1080p resolution, while the higher-end Pro variant will boast a curved AMOLED E6 display with 2K+ LTPO resolution. Both models will include a hole-punch selfie camera positioned in the center of the screen.A distinctive aspect is that Xiaomi will manufacture these devices using a new packaging technology called COP (Chip on PI), aiding in further reducing the screen bezels. The COP packaging process involves directly bending a portion of the screen to narrow the bezels, aiming for a nearly bezel-less visual effect. Xiaomi has previously employed this process in the Civi 1S, as shown in the image below.
. The anticipated release date is expected to be in November.
Source: Gizmochina
