Buzz
The next generation of PlayStation might be powered by AMD's Zen 6 and 3D V-Cache technology, promising impressive performance.
Sony is collaborating closely with AMD on the creation of the next PlayStation console. According to recent leaks, the chip design for PlayStation 6 is nearly complete and ready to enter production.
While working hard to win over gamers with the improvements of PlayStation 5 Pro, Sony has set the starting price at $700, a premium cost. Despite this, the product is seen as performing well in the market. Meanwhile, Sony is also concentrating efforts on the next PlayStation, with crucial assistance from AMD in designing the new system-on-chip architecture.
The PlayStation 6's GPU is said to be based on AMD's 'gfx13' platform, which is part of the 'UDNA' architecture being developed by AMD. This is expected to bring a significant performance leap compared to previous GPU designs based on RDNA.
A recent rumor from China's Chiphell forum highlights the potential use of 3D V-Cache technology in PlayStation 6. This innovation could enable the stacking of RAM cache chiplets on both the CPU and GPU, potentially offering a major performance boost. Even Microsoft is reportedly exploring similar solutions for their next-gen gaming console.
According to insider KeplerL2, Sony and AMD have completed the designs for two different SoCs for the PS6 and have entered the pre-silicon validation stage. The 'A0 tapeout' is expected later this year, raising hopes that the new console could launch sooner than anticipated.
Sony, a brand known for its reliable hardware development cycle, typically completes the A0 tapeout phase about two years before a product is released. Based on this timeline, the latest PlayStation hardware could be expected to launch in 2027.
The PlayStation 6 is expected to utilize AMD's latest Zen 6 architecture, built using the company's newest CPU technology and manufactured with TSMC's 3nm process. It may be introduced to the market in 2026. KeplerL2 also highlighted that the new CPU microarchitecture design is complete, with some components being produced using TSMC's 2nm process, promising significant improvements in performance and energy efficiency.
